J-LED PACKAGE, SOCKET SYSTEM AND BOARD SYSTEM

摘要

PURPOSE:To efficiently radiate the heat generated by an IC to the outside by arranging leads so that the heights of the other ends of the leads can be arranged at the same light as that projecting section of a package base section. CONSTITUTION:A projecting section 7a having the thickness corresponding to the heights of metallic leads 2 is provided on the base of a package base section 7. Then a heat transferring route is constituted between the base of the section 7 and a printed wiring board 3 by closely adhering the board 3 to the section 7. In addition, metallic through holes 6 having high heat conductivity are formed through the board 4 which is in contact with the projecting section 7a at the base of the package base 7 from the surface 3a to the rear 3b of the board 3. The heat generated from a power supply/ground layer 4 in the board 3 is radiated to the air by using the through holes 6 as a heat medium or from the rear 3b of the board 3.