| 摘要 |
PURPOSE:To make a rigid board section more thinner and a flexible section more flexible by applying conductive dyestuff to only the necessary sections (keeping away from a plating through-hole section). CONSTITUTION:A shield flex rigid four-layer wiring board is constituted of a rigid board section 1, an FFC (flexible printed wiring) section 2, through-hole (connection) sections 3, a conductive dyestuff-made shield layer 4, an inner-layer circuit 5, an outer-layer circuit 6, and a cover lay layer 7. As for the conductive dyestuff, dyestuff or paste having a proper degree of viscosity is used. The dyestuff or paste is made by a method wherein metal powder such as copper or metal-powder-coated inorganic powder or conductive powder which is carbon black or a combination of one or more kinds of that sort of materials is dispersed in the base resin which is light or electron beam hardening resin or a combination of one or more kinds of those and if necessary, a mucilage is added for a proper viscosity. As for the shape of the conductive powder, any shape is available. |
