| 摘要 |
PURPOSE:To enable an opticalpwaveguide core and an optical semiconductor device to be accurately aligned with each other by a method wherein an optical axis is changed in height from the surface of a silicon substrate when the optical waveguide core and the optical semiconductor device are optically coupled together. CONSTITUTION:An optical semiconductor device bonding pad 17 is provided to the surface of a clad layer 3 at a prescribed position. Then, a mask 18 is formed so as to cover a part, where an optical semiconductor device 8 is bonded and another part where a core 4 is formed, and then an optical waveguide layer 20 composed of clad layers 2 and 3 and the core 4 and an SiO2 film 14 are etched so as to make a V-shaped groove 5 and lens guide V-shaped holes 6 and 7 exposed. The mask 18 is removed off, and the bonding pad 17 is exposed. Next, a plane parallel plate guide groove 13 is formed by a dicing saw, and the optical semiconductor device is flip-chip bonded to the bonding pad 17. Therefore, even if an optical semiconductor device is irregular in outer shape, it can be comparatively accurately positioned. |
