| 摘要 |
A hybrid integrated circuit comprising a ceramic substrate, a copper plate having a thickness of 1 to 100 mu m formed by adhering a copper material to the ceramic substrate, an insulating layer having a thickness of 10 to 100 mu m formed on said copper plate by means of screen printing, and a wiring layer having a thickness of 5 to 80 mu m formed on said insulating layer by means of screen printing, and a method for manufacturing the same. |
