| 摘要 |
<p>PURPOSE:To provide a substrate for mounting electronic parts with an improved degree of freedom for designing wiring, achieving a high packaging density. CONSTITUTION:This substrate is provided with a multilayer substrate 67 consisting of an upper-layer plate 6 and a lower-layer plate 7 and a recessed part 80 for mounting electronic parts. The recessed part 80 for mounting is formed by a parts mounting part 8 and mounting holes 60 and 70 provided at the multilayer substrate 67. A first circuit 14 is provided on the lower surface of the lower layer plate. The first circuit and the parts-mounting part 8 continue through via holes 72 and 73. The wall surface of the mounting hole 70 at the lower-layer plate is provided with a cavity plating layer 22 and a second circuit 23 and a second pad 21 are provided inside the lower-layer plate and on the upper surface of the lower-layer plate, respectively. Both continue via the cavity plating layer. The cavity plating layer and the parts mounting part 8 are electrically shielded. The first and second circuits are, for example, the wiring for ground and/or wiring for power supply.</p> |
