| 摘要 |
<p>PURPOSE:To improve the heat radiating and moisture resistance of a semiconductor device and, at the same time, to prevent the formation of resin burrs by coating the main surface of a semiconductor pellet opposite to its lead connecting surface with a soft film and exposing the soft film from part of a resin sealed package. CONSTITUTION:A semiconductor device 15 is provided with a semiconductor pellet 12, a plurality of leads electrically connected to the electrodes 12a of the pellet 12, and a package 14 which seals the pellet 12 and a part of the leads 6. In such a semiconductor device 15, the main surface of the pellet 12 opposite to its connecting surface with the leads 6 is coated with a soft film 10 formed of a soft material and the film 10 is exposed from part of the package 14. For example, the semiconductor device 15 is composed of TSOP IC and the film 10 is formed by using polyimide-isoindro-quinazolidione.</p> |
