| 摘要 |
<p>PURPOSE:To perform the precise prealignment of the next substrate while a substrate processing means processes one sheet of wafer, by correcting cross marks after performing the measure for precise alignment on a carry means. CONSTITUTION:After finish of rough prealignment, in the detection precise prealignment on a carry band part 201 before delivering to an XY-stage, the cross marks 41 and 42 of a wafer W are detected by shifting the band side. Furthermore, as regards the correction drive after detection of the cross marks 41 and 42, for theta direction, they are corrected with a carrying-in band part 201, and for X- and Y-directions, they are corrected with the X- and Y-stage of an exposer body So. Accordingly, while the processing means for a substrate processes one sheet of wafer, the precise alignment of the next substrate is performed in parallel, and the throughput shortens.</p> |
