| 摘要 |
PURPOSE:To provide a method for manufacturing circuit boards with a high- burability molding die and excellent productivity, concerning a method for manufacturing circuit boards having electric circuits, terminals, etc., on the surfaces, especially for those molded into solid shapes. CONSTITUTION:Molding is performed by injecting thermoplastic synthetic resin material into a fundamental die 1 having ridgelike projecting streaks 3 corresponding to an electric circuit, and a transfer die 9 having projecting streaks 3 exposed from a resin layer 8 is made. After circuit conductors 10 are formed at the top parts 3a of the projecting streaks 3 by plating this transfer die 9, secondary molding of injecting thermoplastic synthetic resin material into the transfer die 9 again is performed. And the thermoplastic synthetic resin materials are united into one body, and the circuit conductors 10 are transferred to the thermoplastic synthetic resin material to manufacture a circuit board. |
