| 摘要 |
PURPOSE:To provide an inexpensive high quality exposed heat sink, and manufacturing method thereof, being employed in a semiconductor device. CONSTITUTION:The semiconductor device comprises a semiconductor element 3 disposed in a space defined by the leads of a lead frame 1 with the bonding pads being bonded through wires 5 to the leads, and a high thermal conductivity material having outer periphery superposing on the leads. The semiconductor device further comprises a protruding heat sink 4a with the semiconductor element 3 being disposed directly in the center, an insulator disposed on the leads in order to bond the semiconductor to the heat sink, and a package 6 sealed with resin except a part of the leads and the top surface of the protruding heat sink. The insulator 2 covers a part of the leads and extends like a tape along the inner side face abutting on the outer peripheral edge of the heat sink 4 having constricted profile. |
