SEALING DEVICE AND METHOD USEFUL FOR LINKING INTERVAL BETWEEN MATERIALS HAVING THERMAL EXPANSION DIFFERENCE IN SEMICONDUCTOR TREATING DEVICE

摘要

PURPOSE: To provide a sealing member wherein a first part can be operated under a first pressure and a second part can be operated under a second different pressure, in a semiconductor treatment chamber. CONSTITUTION: This sealing device has typically a strip type form or a belt type form, and includes a thin metal inclusion layer 202 soldered to at least two different surfaces in a treatment member. A first part and a second part of the chamber are put under mutually isolated pressures. The metal inclusion layer 202 desirably shows a sectional thickness of at most about 0.039 in. (1 mm). It is especially useful when the surfaces connected by the thin metal inclusion layer 202 have difference of coefficient of linear expansion of at least 3×10<-3> in./in./ deg.C at 600 deg.C.