| 摘要 |
PURPOSE:To obtain a semiconductor device having a smaller size by deciding the diameters and sizes of bonding wires and surface electrodes in accordance with the current capacity of the semiconductor device so that a semiconductor pellet itself can be reduced in size. CONSTITUTION:A semiconductor pellet 5, is mounted on a substrate 1 and, at the same time, the surface electrodes 8 and 9 of the pellet 5 are respectively connected to leads 3 and 4 through bonding wires 6 and 7 and the pellet 5, bonding wires 6 and 7, and parts of the leads 3 and 4 are molded with a resin 10. In such a semiconductor device, the diameters and sizes of the wires 6 and 7 of the electrodes 8 and 9 are decided in accordance with the current capacity of the semiconductor device. When the pellet 5 is composed of a transistor, for example, the diameter of the wire 7 connected to the base electrode 9 is made smaller than that of the wire 6 connected to the emitter electrode 8 and, at the same time, the size of the electrode 9 is made smaller than that of the electrode 8. |
