ELECTRONIC CIRCUIT DEVICE

摘要

PURPOSE:To provide a mounting structure easy to inspect connection with high reliability and a mounting structure hard to generate rolling and tilting of the leadness components in an electronic circuit device with the bump- mounted leadness components on a wiring substrate. CONSTITUTION:A conductive bump 14 connecting a land 13 of a wiring substrate 15 to an electrode 32 of a leadness component 31 is integrally extended up to the side of the electrode 32 of the leadness component 31. Further, a spacer is formed in a gap between a wiring substrate 15 and the leadness component 31.