Testen von elektronischen Anordnungen unter Verwendung der Rotortechnik zum Anordnen der Fühler

摘要

The present invention is an improved printed circuit board test system (30) in which test probes are positioned to electronically engage a selected device or printed circuit board section on a printed circuit board (41) for testing the printed circuit board (41) for manufacturing defects. The printed circuit board test system (30) uses a bed-of-nails test fixture (36) to ground and excite predetermined sites on a first side of the printed circuit board (41) and a robot (38) to mechanically position test probe(s) at selected test sites on a second side of the printed circuit board (41). A controller (31) is used to control the movement of the robotic tester (38) and the selection of spring probes in the bed-of-nails fixture (36) to be exited, grounded or measured. <IMAGE>