| 摘要 |
<p>A laminate capable of mounting semiconnductor elements thereon, comprising an insulating layer which is constituted by a resin portion of sea-island structure (2) and a woven reinforcement (1). The resin portion of sea-island structure (2) is, for example, such that a resin as islands (3) are dispersed in a resin as a matrix. Thus, the insulating layer exhibits a coefficient of thermal expansion of 3.0 SIMILAR 10 [ppm/K] in a planar direction thereof and a glass transition temperature of 150 SIMILAR 300 [ DEG C]. Owing to these physical properties, thermal stresses which the laminate undergoes in packaging the semiconductor elements thereon can be reduced, so that the connections of the laminate with the semiconductor elements can be made highly reliable. <IMAGE></p> |
