Microelectronic package comprising metal housing grounded to board edge

摘要

A microelectronic package (10) comprises a printed circuit board (12) enclosed within a metal housing (14) for shielding the board from spurious electromagnetic signals. The housing includes a base (30) having side walls (36). A series of first tabs (42) are formed in the side walls and engage the upper face (16) of the printed circuit board to secure the board within the housing. The side walls also include a series of second tabs (46) that engage the edge (20) of the printed circuit board in contact with the ground plane to enhance grounding of the housing.