| 摘要 |
An electrical interconnection board (e.g., a backplane) in which connection positions are spaced along one dimension of the board. Each connection position includes holes for making electrical connections. Layers of the board each have a pattern of conductive path segments connecting holes at each connection position with corresponding holes at other connection positions. The path segments together define continuous conductive routes along the length of the board. Each conductive route includes path segments which respectively lie on different layers. This arrangement increases the distance along which any two pairs of the conductive routes are adjacent each other on a layer, thus reducing interference (e.g., mutual coupling and crosstalk) and improving signal transmission characteristics.
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