发明名称 |
Input/output (I/O) thin film repair process |
摘要 |
Missing thin film metallurgy on substrates is replaced during the manufacture of thin film electronic circuits. The process allows the missing thin film metallurgy, such as an input/output (I/O) pad or pads, to be replaced quickly and simply, without damaging the other I/O pads or thin film metallurgy already applied to the substrate. The process essentially uses lift-off technology without building a complete lift-off stencil.
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申请公布号 |
US5397607(A) |
申请公布日期 |
1995.03.14 |
申请号 |
US19940243898 |
申请日期 |
1994.05.17 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SHIELDS, RONALD R.;SMITH, KURT A.;MCDONALD, RONALD J. |
分类号 |
G03F1/00;H01L21/768;H05K3/00;H05K3/06;H05K3/14;H05K3/22;(IPC1-7):B05D1/36 |
主分类号 |
G03F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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