| 摘要 |
PURPOSE:To provide a heat sink for semiconductor devices to which a sealing resin is closely adhered and which has a high moisture resistance and is free from the cracking of the resin. CONSTITUTION:A heat sink 11 is formed of a Cu-based metal. The upper surface 11a of the heat sink 11 is plated with Ag 16 so as to secure a conductivity and to prevent the formation of a CuO film. A CuO film 17 is formed on the side face 11b and bottom face 11c of the heat sink 11. After mounting a semiconductor S on the heat sink 11, leads 12 are stuck to the peripheral part of the heat sink 11. The leads 12 are connected to the semiconductor S through bonding wires W. Then the semiconductor S, heat sink 11, and inner end sections of the leads 12 are sealed with a resin 15. The heat sink 11 has an excellent bite with the resin 15 due to the CuO film 17 and the resin 15 closely sticks to the heat sink 11. |
