| 摘要 |
PURPOSE:To provide a method of manufacturing a ceramic insulating board, which is given a conductivity between the surface and rear of a specified site on the board, without going through a process for performing a through hole processing and a through hole printing. CONSTITUTION:A cerantic green laminated material 5 provided with a builtin linear electrode 2 is formed, this laminated material is cut on a surface, which intersects orthogonally the linear electrode, of the material 5 before or after being sintered and this cut surface A is used as the surface of a new ceramic insulating board. |
