| 摘要 |
PURPOSE:To provide a light emitting and receiving element device having a structure capable of easily aligning respective optical element with high accuracy at the time of assembling. CONSTITUTION:This light emitting and receiving element device has a package member 14 and a semiconductor substrate 16 adhered via a resin, such as epoxy, onto this package member 14. This semiconductor substrate 16 is provided with reflection mirrors 18 formed by subjecting the slopes formed by chemical etching of the substrate 16 to vapor deposition of metal, a pair of the receiving elements 20 formed in regions on both sides of the reflection mirrors 18 and a through-hole 22 formed in the region on the side facing the reflection mirrors 18. A semiconductor laser 24 is positioned within this through-hole 22. This semiconductor laser 24 is brazed onto the package member 14 with a solder material via a sub-stem 26. |
