| 摘要 |
<p>PURPOSE:To omit a bump welding process and, at the same time, to make the heights of bumps uniform so as to reduce as much as possible various kinds of stresses applied to a semiconductor chip or semiconductor device when the chip or device is mounted by forming in advance the base sections of the bumps of a resin on the surface of a substrate. CONSTITUTION:A conductor pattern 12 contains a plurality of bumps to be connected to external terminals. Each bump is composed of a bump base section 14 made of a resin and protruding in a column-like state from the surface of a resin substrate 10, conductor layer 16 extended from the pattern 12 and coats the entire surface of the base section 14, and metallic layer 18 covering the surface of the layer 16 and composed of a solder metal. The resin used for forming the base section 14 must have a melting point and decomposition temperature higher than the melting point of the solder metal constituting the layer 18. Therefore, the heat applied at the time of mounting a semiconductor device can be such a quantity of heat that is sufficient to melt the layer and thermal stresses caused by the heat-treatment when the semiconductor device is heat-treated can be reduced. In addition, stresses caused by pressurization can be also reduced, since the heights of the bumps can be made uniform.</p> |
