摘要 |
<p>PURPOSE:To provide a semiconductor chip suction equipment which is capable of holding a semiconductor chip possessed of a contact-inhibiting region by suction without tilting it and causing damage to its contact-inhibiting region when a semiconductor chip is handled. CONSTITUTION:A semiconductor chip 1 is sucked and held through the intermediary of a suction collet 10 provided with a chip contact 11 which comes into contact with the edge region 4 of a semiconductor chip 1 possessed of a contact- inhibiting region on its one side, a recess 12 provided to the inner side of the chip contact 11, and a suction hole 13 formed communicating with the recess 12.</p> |