| 摘要 |
<p>PURPOSE:To conduct an aligning operation while directly monitoring a die having a semiconductor chip and an electrode pattern, and also to obtain a device with which a semiconductor chip can be mounted accurately on the specified part by a method wherein the semiconductor chip and the die are aligned on a base located at equidistance from the supporting point with the supporting point as the symmetrical center. CONSTITUTION:The electrode-formed surface of a semiconductor chip where a photo element and an electron element are monosilicly integrated, and a die 10, where a wiring pattern is formed for feeding of a current to the semiconductor chip 7, are connected by soldering. In such a flip chip mounting device as above-mentioned, a base 11, on which the die 10 is placed on an arm 12 with a supporting point 6 as the symmetrical center, and base 8, with which a semiconductor chip 7 is placed on the other arm 9, are provided and two arms 9 and 12 are formed in the same length. Besides, the base 8 for the chip 7 is brought into the state wherein the position of the semiconductor chip 7 can be adjusted to X-axis, Y-axis, Z-axis and theta-axis directions, and also the base 8 can be superposed on the base 11 carrying the die 10 with the supporting point 6 as the center.</p> |
