| 摘要 |
<p>PURPOSE:To provide a lead frame which is excellent in massproductivity and easy to cope with design change. CONSTITUTION:The title lead frame is provided with the following; an island 13 on which an IC chip 17 is mounted, at least a pair of retaining parts 15 which protrude parallel with each other from the island 13, adhesive tapes 16 bridging the part between the retaining parts 15, and a plurality of leads 14 which are composed of wire material and held by the adhesive tapes 16.</p> |
