| 摘要 |
PURPOSE:To provide a method of forming bumps, in which a screen is easily released. CONSTITUTION:Bumps 51 of conductive bonding agent 5, which increases its bonding power by heat, are attached to the upper surface of a substantially flat plate 1 coated with adhesive 2. A semiconductor chip 10, heated, is placed and pressed against the bumps so that they can be bonded. Then, the adhesive 2 is removed by organic solvent, for example, isopropyl alcohol, before the plate 1 is separated from the bumps. The adhesive 2 may also be of the type that increases its adhesiveness by heat. |
