| 摘要 |
<p>PURPOSE:To provide a printed board in the increased package density in the long direction by shortening the chip component interval keeping in-series arrangement state of chip components furthermore enhancing the solderability of the chip components onto a common land. CONSTITUTION:Within the printed substrate comprising two each of chip type circuit components arranged in-series, the two each of chip type circuit components are provided in almost contact state on a common land 20a capable of holding the electrical connection to the two each of chip type circuit parts in common. At this time, the common land 20a is provided to be protruded from both sides of respective two each of chip components 11a, 11b.</p> |
