| 摘要 |
<p>PURPOSE:To prevent the characteristic failure or continuity failure of a laminated ceramic electronic component from being generated without reducing the filling rate of a conductor paste in holes by a method wherein the conductor paste filled in the holes to be used as via holes is dried and after that, excess parts, which adhere on the main surface of a carrier film and on the peripheries of the holes, of the paste are wiped. CONSTITUTION:A ceramic green sheet 2 is formed on a carrier film 1 and holes 3 to be used as via holes to penetrate both of the film 1 and the sheet 2 are provided. Then, a conductor paste 6 is filled in the holes 3 by a screen printing. At that time, overhung excess parts 7 of the paste adhere on the main surface of the film 1 and on the peripheries of the holes 3. Then, the paste 6 is dried and the excess parts 7 are wiped. The already-solidified conductor paste parts in the holes 3 are never raked out. Then, circuit elements 14 are formed and the film 1 is peeled and is stacked on other ceramic green sheet. After that, the laminated carrier films are pressed and are calcined.</p> |
