| 摘要 |
PURPOSE:To shorten the time of an irradiation treatment using an electromagnetic wave, such as a laser beam, and to increase the productivity of a circuit board. CONSTITUTION:Such a plated base layer 2 as a film consisting of a catalyst for plating, a film consisting of a catalyst compound for plating, a metal film or the like is formed on the surface of an insulating base material 1. An electromagnetic wave, such as a laser beam, is emitted on at least the boundary regions between a circuit part 3 and non-circuit parts 4 of the base material 1 in such a way as to correspond to non-circuit part 4 patterns, whereby the layer 2 at these irradiated parts irradiated with electromagnetic waves, such as laser beams, is removed leaving the layer 2 at the non-emitted parts. After this, a plating is applied to the surface of the layer 2 at the non-irradiated parts. The emission of the laser beam or the like has only to be performed on at least the boundary regions between the circuit part 3 and the circuit insulating parts 4 out of the circuit insulating parts and there is no need to irradiate the whole surface of the wide region of the insulating parts 4 with laser beams. |
