SEMICONDUCTOR DEVICE AND METHOD AND DEVICE FOR ITS MOUNTING

摘要

PURPOSE:To contrive high density mounting without decreasing bonding strength. CONSTITUTION:The No.1 in the diagram is a semiconductor element, No.2 is a lead to be connected to the semiconductor element and an external electrode 5, and No.3 is a light transmitting insulating film. No.4 is a light transmitting insulating film with which the lead is connected and fixed on the upper surface of the closely adhered surface of the lead and the external electrode to prevent the deformation of the lead. No.6 is a bonding tool used to connect the lead 2 and the external electrode 5. The part protruding from the insulating film 4 of the lead 2 is pressed and heated using the bonding tool 6. As a result, the Pb-Sn eutectic solder fed to the lead 2 and the external electrode 5 is fused and the two materials are connected.