| 摘要 |
<p>PURPOSE:To lessen the temperature rise of an element during electron emission and lessen the dispersion between the element of currents inside an insulating substrate, and improve the efficiency of electron emission by forming a groove in the insulating substrate at the crack part of a conductive film. CONSTITUTION:In the first place, after cleaning of an insulating substrate 1, element electrodes 2 and 3 of, for example, Ni are formed on the surface by vacuum evaporation and photolithography technology. Solution of organic compound, which has Pd, Ru, or the like for its main element, is applied on over the electrodes 2 and 3, and left as it is to form a film. This organic metallic film is heated and baked and is patterned by lift off, etching, or the like so as to form a thin film 4 for formation of an electron emission part. A current is applied between the electrodes 2 and 3 so as to form a crack part in the electron emission part 5. With the island structure of the thin film 4 as a mask, a groove 6 is formed in the substrate 1 in the emission part 5 by dry or wet etching process.</p> |
