METHOD FOR CONNECTING ELECTRICALLY INTEGRATED CIRCUIT WITH SUBSTRATE, AND INTEGRATED CIRCUIT ASSEMBLY

摘要

PURPOSE: To provide a method for connecting an integrated circuit chip electrically with a board in which a defective chip can be replaced easily without causing any damage on the board. CONSTITUTION: A nonadhesive anisotropic conductive material sheet 18 having an opening 24 is arranged on a substrate 12 to expose the part of the board 12 between a pair of metallization regions 16 through the opening 24. The opening 24 is then filled with an adhesive 26. An integrated circuit chip 10 is then arranged on the nonadhesive anisotropic conductive material sheet 18 while matching each conductive material 14 with the metallization region 16, bonding a part of the integrated circuit chip 10 to the board 12 through the adhesive 26 and compressing the nonadhesive anisotropic conductive material sheet 18.