| 摘要 |
PURPOSE:To make the light emitting characteristics of the array of LEDs uniform by supporting a semiconductor light emitting device mounted on a circuit board with a plurality of conducting members formed on each individual electrode and each common electrode, forming the common electrodes on both sides of the array of the LEDs, and eliminating the dispersion of contact resistances. CONSTITUTION:A semiconductor light emitting device 1 mounted on a circuit board is supported through a plurality of gold bumps 11 formed on each individual electrode 4 and each common electrode 5. The common electrodes 5 are formed on both sides of the array of LEDs 3. Thus, the distance between the gold bump 11 formed on the common electrode 5 on one side and the gold bump 11 formed on the common electrode 5 on the other side becomes wide. In comparison with the case, wherein the individual electrode 4 is formed only on one side of the array of the LEDs 3, the distance between the gold bump 11 formed on the individual electrode 4 on one side and the gold bump 11 formed on the individual electrode 4 on the other side becomes wide. Thus, all conductive members and the wirings on the circuit board can be connected in good balance. |
