| 摘要 |
<p>PURPOSE:To eliminate the copper foil plating step on an insulating layer and the etching step of the soldering part of a heating element by a method wherein a multilayered printed-wiring board is fixed to a part of an insulating film while the heating element is fixed to the other part whereto the board is not fixed. CONSTITUTION:A both surfaced glass expoxy resin plate 14 whereon copper foils 12 is plated is bonded onto an insulating layer 11 of a multilayered printed board part 20a while a semiconductor 15 to be a heating element is bonded onto a fixed part 21 through the intermediary of a heat sink 13 (e.g. molybdenum, copper). On the other hand, the semiconductor 15 soldered onto the heat sink 13 has a continuity to the copper foils 12 by wires 16. Accordingly, when the thickness, material quality, etc., of the heat sink 13 and a bonding agent layer 30 are set up not to be unfavorably affected by the heat of the semiconductor 15, the working manhours in the manufacturing step such as etching step, etc., can be cut down thereby enabling the manufacturing cost to be cut down also.</p> |
