| 摘要 |
PURPOSE:To prevent the scattering of solder at the time of sealing by preventing the formation of a void in a solder layer formed on a ceramic lid substrate in which a solder layer forming metallic layer containing a precious metal is formed by baking glass frit. CONSTITUTION:After forming a first metallic layer 6a on a ceramic substrate 2 by printing and baking Ag-Pd paste containing glass frit G on the substrate 2, a second metallic layer 6b is formed on the layer 6a by printing and baking Ag-Pd paste containing no glass frit. Therefore, the glass frit G is not exposed on the surface where a solder layer H is formed. Since no glass frit exists on the boundary between the metallic layer 6b and solder layer H, no void is formed in the layer H. |
