| 摘要 |
PURPOSE:To easily form a desired conductive circuit and an insulating part of a wide area without reducing the visual appearance, form, insulation properties and the like of the conductive circuit by a method wherein a metal layer of a desired thickness is given on a conductive circuit pattern by an electroplating and thereafter, a metal thin film layer on the insulating part is subjected to flash etching and is removed. CONSTITUTION:A metal covering process is performed on the surface of a molded item, which is resin-molded by an injection molding or the like and is subjected to physical surface treatment, and a metal thin film having a thickness of 0.2 to 4mum is formed. In the molded item, a laser beam 6 is applied to a contour line part of an insulating circuit part to selectively remove scatteringly the metal thin film and a circuit pattern 4, which is surrounded with an insulating closed circuit and consists of the metal thin film, is formed. Moreover, an electroplating is applied to a conductive circuit part and a metal layer is added to form a conductive circuit 3. In the molded item, which has the circuit 3 added with the metal layer and has a chemical plating left at an insulating part, after an etching resist is applied on the conductive circuit part only, the chemical plating left at the insulating part is dissolved and removed by flash etching. |
