| 摘要 |
<p>A CPU IC package (23) for a computer system (11) is cooled by a layer of compressible, heat-conducting material (25) compressed between the IC package (23) and a heat sink plate (21). In one embodiment the heat sink plate (21) is a wall element of an access panel (20) providing access to the interior of the computer system (11). Closing the access panel (20) compresses the heat-conducting material (25) between the IC package (23) and the heat sink plate (21). To provide mechanical stability, the heat-conducting material is fastened to one of the heat sink plate and the IC package. In alternative embodiments the plate may be mounted outside the enclosure of the system with the heat-conducting material extending through an opening in a wall of the enclosure.</p> |
