发明名称 |
LEAD-FREE SOLDER ALLOY |
摘要 |
A non-toxic alloy for soldering electronic components comprising 90% Sn, 5% In, and 5% Ag. The disclosed alloy has a fine microstructure. Particles of intermetallic compounds are finely dispersed throughout the matrix, thereby inhibiting grain growth. Accordingly, the alloy does not significantly coarsen after thermal aging.
|
申请公布号 |
CA2131256(A1) |
申请公布日期 |
1995.03.08 |
申请号 |
CA19942131256 |
申请日期 |
1994.08.31 |
申请人 |
FORD MOTOR COMPANY OF CANADA, LIMITED |
发明人 |
SHANGGUAN, DONGKAI;ACHARI, ACHYUTA |
分类号 |
B23K35/26;C22C13/02;(IPC1-7):B23K35/26 |
主分类号 |
B23K35/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|