发明名称 Förfarande för upphettning av lim samt anordning för genomförande av förfarandet
摘要 The present invention relates to a method and to apparatus for accelerating the curing of glue joints (4) as the glue joints move, and particularly to the curing of glue joints between two elongated objects which are to be glued together end-to-end, wherein the glue joints are cured in a high-frequency (HF) electric field generated between two electrode surfaces (5, 3) disposed on respective opposite surfaces of the mutually joined objetcs and connected to a high-frequency generator. The inventive method comprises causing a high-frequency field which is limited essentially to the glue joint to accompany the glue joint through a specific distance sufficient to achieve curing of the glue in the glue joint. The apparatus is characterized in that the first electrode surface (3) is stationary and elongated and has a length sufficient to achieve curing of a glue joint that moves along the electrode surface. The other electrode surface (5) is arranged for movement in the movement direction of the glue joint (4) and has a surface which at least covers the glue joint.
申请公布号 SE9500801(D0) 申请公布日期 1995.03.06
申请号 SE19950000801 申请日期 1995.03.06
申请人 STENLUND MASKINER AB 发明人 KLAUS *KUELPER;STEN-AAKE *STENLUND
分类号 B27D1/10;B27M3/00 主分类号 B27D1/10
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