METHOD FOR MOUNTING CHIP PART

摘要

PURPOSE:To position an optical element with high accuracy at the time of mounting the optical element by self-alignment by utilizing the reflow of solder bumps. CONSTITUTION:AuSn solder bumps 3 are formed on electrode pads 2 provided on a sub-substrate 1 for mounting optical element and a light emitting diode chip 5 having electrode pads 4 for an optical element is put on the bumps 3 (a). When the bumps 3 are melted by heating the sub-substrate 1 on a heating stage 6 and a load is applied to the sub-substrate 1 and chip 5, the solder bumps 3 are deformed and the oxide films on the surfaces of the bumps 3 are broken (6). Therefore, the surface tension required for self alignment (c) is obtained and the chip 5 is positioned with high accuracy.