| 摘要 |
<p>PURPOSE:To lessen the total thickness of an insulating board and a semiconductor device by a method wherein outer leads are led out of the side ends of a sealing resin body, and a mounting pad is exposed out of sealing resin. CONSTITUTION:An opening is provided to an insulating board 6 on which a circuit pattern 5 is formed, and a mounting pad 2 is fixed to the opening through the intermediary of an adhesive layer 3. Thereafter, a semiconductor device 1 is mounted on the mounting pad 2. The electrode 10 of the semiconductor device 1 and a circuit pattern 5 formed on the mounting pad 2 are electrically connected together with a bonding wire 4. A solder resist 7 of nearly the same size with a sealing resin 8 is formed on the circuit pattern 5 to prevent resin from leaking out through the circuit pattern 5. Outer leads 9 are subjected to a solder plating process or a dip soldering process, formed, and soldered to a printed board.</p> |
