| 摘要 |
PURPOSE:To enable a wire bonding device equipped with a heating piece and a window clamper to perform reliable wire bonding. CONSTITUTION:In a wire bonding device equipped with a heating piece 27 on which a lead frame 33 mounted with a semiconductor chip 21 is placed and a window clamper for fixing the frame 22 on the piece 27 by pressing prescribed positions of the frame 22 against the frame 22, projecting sections 29 which bend the frame 22 in the direction opposite to the pressing direction of the clamper are formed on the piece 27 at the positions corresponding to the connecting positions of wires 26. In addition, a plate spring is installed to the clamper so as to press the frame 22 by utilizing the elastic force of the spring. |
