| 摘要 |
<p>PURPOSE:To improve the reliability of solder bumps by reliably joining the solder bumps regardless of the height variation of the solder bumps. CONSTITUTION:After removing oxide films formed on the surfaces of bumps 13 formed on the electrode pads 12 of a semiconductor chip 11, the heights of the bumps 13 are measured. According to the height-measurement results of the bumps 13, the chip 11 is tentatively thermocompression bonded to a circuit board 17 at a prescribed interval, and then, the chip 11 is finally joined to the board 17 at the prescribed interval.</p> |
