发明名称 SEMICONDUCTOR CHIP
摘要 <p>PURPOSE:To mount bonding pads as they are on two or more kinds of packages having different connecting terminals by arranging bording pads corresponding to a package having a different arrangement of connection terminals with specified functions. CONSTITUTION:Bonding pads are for a data B terminal 10a, data B terminal 10B, VDD terminal 10C, mode terminal 10D, shift terminal 10E, mode terminal 10F, clock terminal 10G, GND terminal 10H, clock terminal 10I, VDD terminal 10J, etc. Although there are provided two mode terminals 10D, 10F and two clock terminals 10G and 10I, the other terminals are provided one for each function. The mode and clock terminals 10D and 10F are electrically connected to each other through a wiring layer 15. In addition, the clock terminals 10G and 10I are electrically connected to each other through another wiring layer 16. Therefore, the bonding pads can be mounted as they are on two or more kinds of packages having different connecting terminals.</p>
申请公布号 JPH0758145(A) 申请公布日期 1995.03.03
申请号 JP19930202213 申请日期 1993.08.16
申请人 HITACHI LTD 发明人 OHIRA EIJI
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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