| 摘要 |
PURPOSE:To realize a glass ceramic multilayer substrate to be manufactured by low temperature baking, to have a thermal expansion coefficient approximating to that of a silicon chip and to indicate a permittivity low enough to cope with a rapid operational processing, by a method wherein the glass component of the ceramic multilayer substrate comprising the glass component and a filler component has a specific composition. CONSTITUTION:The title glass ceramic multilayered substrate is composed of the glass component of 40-80wt.% and the filler components of 20-60wt.% while the glass components in details comprising SiO2; 20-50wt.%, Al2O3; 10-40wt.%, SrO; 11-25wt.%, MgO; 60-20wt.%, B2O3; 0.1-30wt.%, ZnO; 0.1-30wt.%. In such a composition, specific ratios of SrO and MgO are contained in the glass components to enable strotium feldspar and cordierite to be simultaneously deposited from the glass phase in the baking step so that a lower thermal expansion coefficient capable of directly mounting silicon chip as well as a low permittivity not exceeding seven capable of sufficiently coping with the rapid operational processing step may be realized simultaneously enabling the high mechanical strength to be gained. |
