| 摘要 |
<p>PURPOSE:To lessen a wiring pattern in characteristic impedance change by a method wherein an insulating board whose center part is changed in dielectric constant corresponding to the wire width of the wiring pattern. CONSTITUTION:An insulating board 1 is composed of a ceramic board 1a as a periphery of dielectric constant 10 and thickness 0.4mm and a ceramic board 1b as a center section of dielectric constant 27 and thickness 0.4mm. Concretely, the ceramic boards 1a and 1b are pasted together with glass glaze or the like. A wiring pattern 2 whose peripheral part and center part are 0.35mm and 0.11mm in wire width respectively is formed on the insulating board 1. In result, the wiring pattern 2 lessened in characteristic impedance change and of characteristic impedance 50OMEGA can be obtained. Therefore, a semiconductor package widened in frequency band and enhanced in operation speed can be obtained.</p> |
