发明名称 METHOD FOR INSPECTING PARTS OF SEMICONDUCTOR MOLDING DEVICE, AND SEMICONDUCTOR MOLDING DEVICE
摘要 PURPOSE:To inspect molded pieces reliably during a molding process. CONSTITUTION:A work 19 molded by means of a molding device 11 is received by means of a gate break truck 27 and cooled by blowing air 31 upon the work 19 while the gate part of the work 19 is kept with a gate clamp 30. After cooling, a gate is broken off from the work 19 by means of the truck 27 and clamp 30. At the time of cooling the work 19 with the air blow 31, the image of the work 19 is taken at regular time intervals with an infrared camera 32. A controller 33 discriminates the propriety of the work 19 by comparing the image information with a prestored standard pattern and sorts defective works from good works based on the discrimination results.
申请公布号 JPH0758137(A) 申请公布日期 1995.03.03
申请号 JP19930198698 申请日期 1993.08.11
申请人 TOSHIBA CORP 发明人 TAKEUCHI MASAMI
分类号 B29C43/18;B29C43/58;H01L21/56;H01L21/66;(IPC1-7):H01L21/56 主分类号 B29C43/18
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