| 摘要 |
A system for bonding a condition indicator to an electrochemical cell is disclosed. The system employs an electrically conductive adhesive which bonds the indicator to a terminal of the cell. The terminal may typically be of nickel, copper, brass, silver or tin. The adhesive contains metallic flakes and is preferably a thermally activated polyesterpolyurethane adhesive or a thermosetting adhesive containing acrylate monomers. |
