| 摘要 |
PURPOSE:To realize a thinner package which is lightproof against unwanted light beams with a low cost means. CONSTITUTION:A bump 12 is previously formed with solder on an electrode of a solid state image pickup element 11 (a). An internal lead 14 which also works as a lightproof film is formed on a translucent cap 13. The solid state image pickup element 11 is mounted on the translucent cap 13 with a simultaneous bonding method (b). The translucent cap 13 and the solid state image pickup element 11 are fixed in a case 15 with bonding agents 16, 17. |
