| 摘要 |
PURPOSE:To provide a resin molded electronic device in which the molding resin is not scattered at the time of dielectric breakdown due to application of overvoltage or abnormal voltage. CONSTITUTION:The electronic device is coated with a laminate of spongelike foamed resin layer and unfoamed resin layer. The foamed resin is composed of a cured foamable silicone resin whereas the unfoamed resin composition is composed of a cured powder epoxy resin. |
