| 摘要 |
<p>PURPOSE:To align the bumps of a probe card with the electrode pads of a wafer simply and accurately in a temperature test. CONSTITUTION:By the arranging of bumps 3 on the surface of a polyimide thin film, a probe card 2 is configured, and concurrently, scales 41, 42 are formed respectively in X and Y directions in the periphery of the arrangement of the bumps 3, e.g. by an exposure technique. In case of ordinary temperature, the coordinates of the bumps on the probe card 2 are stored beforehand in a storage part, and in case of the thermal expansion of the probe card, the scales 41, 42 are read by a photographing unit. Based on the read results and the coordinates of the bumps, the data of the coordinates of the bumps at the present time are calculated, and thereby, the position of a wafer putting-on base is controlled.</p> |
